The AIP is pleased to advise that the winner of the 2014 AIP Scholarship, which is awarded to one of the finalists for the Cormack Innovation Awards, was Anuj K Dhawan who is currently a third year student studying Industrial Design at the University of New South Wales.

According to Mr Ralph Moyle FAIP, National President of the AIP; "Anuj Dhawan was selected because he has a keenness to expand his education in the packaging realm."

Anuj added that, "Packaging is so ubiquitous within product design that he believes it is important for all designers to genuinely consider how it enhances or detracts from a product experience.

Winning the AIP scholarship will allow me to expose myself to new technologies, methods, and considerations within packaging." Mr Dhawan said.

The AIP asked Anuj what his goals are moving forward...

"I want to absorb information! A designer's education is never complete; the industry changes so rapidly and so often that setting your sights on one specific detail can result in you missing some incredible opportunities for growth."

Anuj is hoping that once he graduates from the University of New South Wales at the end of 2015 that he will be able to find a packaging role that would enable him to balance his interest in customer experience with that of successful functionality - being able to make a package seduce a customer while retain its inherent protective qualities.

The AIP would like to take this opportunity to congratulate Anuj Dhawan for being such an exceptional candidate and the Institute looks forward to seeing him become an outstanding packaging technologist. A special acknowledgement to Cormack Packaging for their on-going support in not only recognising talented and skilled young designers but also encouraging them to further their careers in the packaging industry.

The Cormack Innovation Awards have been running now for thirteen years and each year a new design brief is presented to Industrial Design Students to engage, teach and consider various packaging options and obstacles. For most students it is the first time they have worked with plastics and also considered that packaging may create career opportunities. Cormack have been delighted to see how many former students from the program are now working in and around the packaging arena.

The Cormack Innovation Award scholarship complements other programs initiated by the AIP including, the APPMA scholarship for the Diploma in Packaging Technology.