An ultrasonically bonded polyethylene back sheet was developed by The Dow Chemical Company and Herrmann Ultrasonics, with advanced ultrasonic technology, to address the key market need for hygiene absorbent products that bring more comfort by decreasing noise and enhancing softness. For many years, the hygiene industry has tried to introduce ultrasonic bonding technology for back sheet lamination to meet cost reduction and sustainability industry drivers. Until now, final haptic properties of the diaper, critical to the consumer, such as noise and softness, had to be sacrificed.

Herrmann Ultrasonics’ VE MICROBOND CSI technology in combination with Dow’s improved PE film formulation offers innovative “Adhesive Free In-line Lamination” that delivers softness and low noise. Increased web speeds (exceeding 2,000 feet per minute), immediate bond strength, quality assurance, and high-speed lamination of multiple layers have also been achieved.